High performance screen printable silicone as selective hybrid IC encapsulant

Author

Wong, C.P.

Author_Institution

AT&T Bell Lab., Princeton, NJ, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

759

Lastpage

765

Abstract

A solvent-, flux-, and detergent-resistant screen-printable silicone (SPS) with a modest curing temperature and excellent adhesion to gold-plated substrate integrated circuits is described. The material formulation and need for an encapsulant with the above properties is described. Microdielectrometry was used to define the precise SPS cure schedule. Temperature humidity bias was used to qualify the material´s electrical performance. Auger spectroscopy and laser ionization mass spectrometry were used to further elucidate the crosslinking density and the interfacial interaction of the SPS and encapsulated substrate

Keywords

Auger effect; adhesion; encapsulation; hybrid integrated circuits; integrated circuit technology; silicones; Au plated substrate integrated circuits; Auger spectroscopy; SPS cure schedule; adhesion; crosslinking density; curing temperature; detergent resistant silicone; electrical performance; encapsulated substrate; flux resistance; interfacial interaction; laser ionization mass spectrometry; microdielectrometry; screen printable silicone; selective hybrid IC encapsulant; solvent resistance; temperature humidity bias; Adhesives; Bonding; Electric resistance; Encapsulation; Hybrid integrated circuits; Optical materials; Protection; Purification; Solvents; Temperature;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62590

Filename

62590