DocumentCode :
1257866
Title :
An LU Decomposition Based Direct Integral Equation Solver of Linear Complexity and Higher-Order Accuracy for Large-Scale Interconnect Extraction
Author :
Chai, Wenwen ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
33
Issue :
4
fYear :
2010
Firstpage :
794
Lastpage :
803
Abstract :
A fast LU factorization of linear complexity is developed to directly solve a dense system of linear equations for the capacitance extraction of any arbitrary shaped 3-D structure embedded in inhomogeneous materials. In addition, a higher-order scheme is developed to achieve any higher-order accuracy for the proposed fast solver without sacrificing its linear computational complexity. The proposed solver successfully factorizes dense matrices that involve more than one million unknowns in fast CPU run time and modest memory consumption. Comparisons with state-of-the-art integral-equation-based capacitance solvers have demonstrated its clear advantages. In addition to capacitance extraction, the proposed LU solver has been successfully applied to large-scale full-wave extraction.
Keywords :
capacitance; circuit complexity; integral equations; matrix decomposition; 3D structure; LU decomposition based direct integral equation solver; LU factorization; LU solver; capacitance extraction; dense matrices; dense system; inhomogeneous material; large-scale full wave extraction; large-scale interconnect extraction; linear computational complexity; linear equation; state-of-the-art integral-equation-based capacitance solver; Capacitance; Computational complexity; Conductors; Electronics industry; Integral equations; Iterative methods; Large-scale systems; Sparse matrices; Direct solver; LU factorization; fast solver; integral-equation-based methods; interconnect extraction;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2010.2053537
Filename :
5524090
Link To Document :
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