DocumentCode :
1257896
Title :
Electrical Shorting Propensity of Tin Whiskers
Author :
Han, Sungwon ; Osterman, Michael ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Consortium, Univ. of Maryland, College Park, MD, USA
Volume :
33
Issue :
3
fYear :
2010
fDate :
7/1/2010 12:00:00 AM
Firstpage :
205
Lastpage :
211
Abstract :
When a tin whisker bridges two differently biased conductors, an electrical short is not guaranteed. In many instances, the voltage must exceed a threshold level in order to produce current flow due to weak physical contact and the presence of a non-conductive film such as an oxide layer. This paper presents a study that examines the breakdown voltage of tin whiskers and its relation to contact force. Whisker contact force studies were conducted using gold- and tin-coated tungsten probes, and the breakdown voltage was measured using a semiconductor parameter analyzer. It was verified that contact force is a critical factor in determining the type of current-voltage transition and level of breakdown voltage. Lower contact force between the probe and the whiskers caused the multiple transitions in current-voltage characteristics. The tin oxide layers on whiskers were analyzed using field emission transmission electron microscopy (FE-TEM).
Keywords :
electrical safety; field emission electron microscopy; semiconductor device breakdown; short-circuit currents; tin compounds; FE-TEM; biased conductors; breakdown voltage measurement; current-voltage transition; electrical shorting propensity; field emission transmission electron microscopy; gold-coated tungsten probes; nonconductive film; oxide layer; semiconductor parameter analyzer; tin whisker bridges; tin-coated tungsten probes; weak physical contact; whisker contact force; Breakdown voltage; Bridge circuits; Conductors; Contacts; Current measurement; Force; Force measurement; Probes; Semiconductor films; Threshold voltage; Tin; Tungsten; Voltage measurement; Breakdown voltage; contact force; electrical short; tin oxide; tin whisker;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2010.2053377
Filename :
5524096
Link To Document :
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