Title :
Flexible electronic assemblies for space applications
Author :
del Castillo, Linda ; Moussessian, Alina ; McPherson, Ryan ; Zhang, Tan ; Hou, Zhenwei ; Dean, Robert ; Johnson, R. Wayne
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fDate :
6/1/2010 12:00:00 AM
Abstract :
This describes the development and evaluation of advanced technologies for the integration of electronic devices within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible (liquid crystal polymer (LCP) and polyimide (PI)) circuits, using gold thermo-compression flip chip bonding, and embedding them within the material. The influence of temperature and flexure on the electrical behavior of active embedded assemblies was evaluated. In addition, the long-term thermal cycle resistance of the passive daisy chain assemblies was determined within the Mil-Std (-55° to +125°C), extreme low #1 (-125° to +85°C), and extreme low #2 (-125° to +125°C) temperature ranges. The results of these evaluations will be discussed, along with the application of this technology for future NASA missions.
Keywords :
avionics; flip-chip devices; integrated circuit bonding; liquid crystal polymers; LCP circuit; NASA missions; PI circuit; Si; active embedded assemblies; electronic devices; flexible electronic assemblies; gold thermocompression flip chip bonding; liquid crystal polymer circuit; long-term thermal cycle resistance; membrane polymers; passive daisy chain assemblies; polyimide circuit; space applications; temperature -125 degC to 125 degC; thinned silicon die; Assembly; Assembly systems; Biomembranes; Flexible electronics; Flexible printed circuits; Joining processes; Liquid crystal polymers; Performance evaluation; Polyimides; Silicon; Space technology; Thermal resistance;
Journal_Title :
Aerospace and Electronic Systems Magazine, IEEE
DOI :
10.1109/MAES.2010.5525317
