• DocumentCode
    1258846
  • Title

    High energy products in exchange-coupled nanocomposite films

  • Author

    Liu, J.P. ; Liu, Y. ; Skomski, R. ; Sellmyer, D.J.

  • Author_Institution
    Center for Mater. Res. & Anal., Nebraska Univ., Lincoln, NE, USA
  • Volume
    35
  • Issue
    5
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    3241
  • Lastpage
    3246
  • Abstract
    Several systems of nanocomposite thin films have been prepared by plasma sputtering and heat treatment. By choosing suitable multilayer structures of the as-deposited films and subsequent heat-treatment processes, the nanostructures of the films have been tailored. The thermal processing is the key to control the morphology. Appropriate heat-treatment processes have been found for the systems studied, which result in the desired nanostructures. For the first time a nearly ideal nanostructure with the soft-phase grains embedded homogeneously in the hard phase grains has been obtained for the FePt-Fe1-xPtx(x~0.3) system. Effective intergrain exchange coupling has been realized. As a consequence, high energy products up to 50 MGOe have been achieved
  • Keywords
    composite materials; exchange interactions (electron); heat treatment; iron alloys; magnetic multilayers; magnetic thin films; nanostructured materials; permanent magnets; platinum alloys; sputtered coatings; FePt; FePt-Fe1-xPtx(x~0.3) system; effective intergrain exchange coupling; exchange-coupled nanocomposite films; hard phase grains; heat treatment; high energy products; morphology; multilayer structures; nanostructures; permanent magnets; plasma sputtering; soft-phase grains; thermal processing; Atomic force microscopy; Couplings; Heat treatment; Magnetic force microscopy; Morphology; Nanostructures; Nonhomogeneous media; Plasma materials processing; Sputtering; Transmission electron microscopy;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.800486
  • Filename
    800486