Title :
Dielectric study of low glass transition temperature cycloaliphatic UV-curable epoxy networks
Author :
Bouanga, C. Vanga ; Couderc, H. ; Fréchette, M.F. ; Savoie, S. ; Malucelli, G. ; Camino, G. ; Castellon, J. ; Banet, L. ; Toureille, A.
Author_Institution :
Inst. de Rech. d´´Hydro-Quebec, Varennes, QC, Canada
fDate :
8/1/2012 12:00:00 AM
Abstract :
This work focuses on the dielectric properties of a UV-cured epoxy network with a low glass transition temperature obtained through photoinduced copolymerization of a cycloaliphatic diepoxy monomer, 3,4-epoxycyclohexylmethyl-3´,4´-epoxycyclohexanecarboxylate (CE), with 1,6-hexanediol diglycidyl ether (HDGE). The crosslinking density of the system has been tuned using different amounts of the low glass transition temperature HDGE comonomer (up to 60 wt.% HDGE). The structural morphology and space charge obtained with the Thermal Step Method were studied following various thermal treatments of the samples. Both the thermal properties and the dielectric responses (dielectric constant) for the UV-cured HDGE/CE systems turned out to be dependent on the structural morphology and composition of the polymer network. In particular, two relaxation modes, γ, β and α were observed, attributed to local molecular motions. Lastly, the potential effect of moisture and/or ions and the effect of space charge on the copolymers were also investigated.
Keywords :
curing; dielectric relaxation; glass transition; moisture; permittivity; polymer blends; polymer structure; polymerisation; resins; space charge; 1,6-hexanediol diglycidyl ether; 3,4-epoxycyclohexylmethyl-3´,4´-epoxycyclohexanecarboxylate; HDGE comonomer; UV-cured HDGE-CE systems; copolymers; crosslinking density; cycloaliphatic UV-curable epoxy networks; cycloaliphatic diepoxy monomer; dielectric constant; dielectric properties; dielectric responses; ion potential effect; local molecular motions; low glass transition temperature; moisture potential effect; photoinduced copolymerization; polymer network; relaxation modes; space charge effect; structural morphology; thermal properties; thermal step method; Dielectric measurements; Dielectrics; Glass; Polymers; Temperature; Temperature measurement; Dielectric relaxation; UV-curing; crosslinking density; epoxy networks; glass transition temperature;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2012.6260001