Title :
Optimized redundancy selection based on failure-related yield model for 64-Mb DRAM and beyond
Author :
Kikuda, Shigeru ; Miyamoto, Hiroshi ; Mori, Shigeru ; Niiro, Mitsutaka ; Yamada, Michihiro
Author_Institution :
Mitsubishi Electr. Corp., Hyogo, Japan
fDate :
11/1/1991 12:00:00 AM
Abstract :
An optimized redundancy scheme for 64-Mb dynamic RAM (DRAM) and beyond that is based on a failure-related yield model is described. This model accounts for three-dimensional memory cell structures and individual design rules used in individual sections of the chip. Failure-mode parameters for the model are determined by performing a trial fuse-blowing test on 4-Mb DRAMs. The test employs a memory tester without requiring complicated visual inspections. The dependence of the yield on block division and the number of spare elements for a 64-Mb DRAM are investigated. In the estimation as a redundancy scheme for the 64-Mb DRAM, more than two spare rows and two spare columns in 1-Mb or less subblocks are shown to be necessary
Keywords :
DRAM chips; circuit reliability; failure analysis; integrated circuit testing; redundancy; 3D cell structure; 64 Mbit; DRAM; design rules; dynamic RAM; failure-related yield model; fuse-blowing test; optimized redundancy scheme; three-dimensional memory cell; Circuit faults; Decoding; Fabrication; Integrated circuit modeling; Integrated circuit yield; Performance evaluation; Random access memory; Redundancy; Semiconductor device modeling; Testing;
Journal_Title :
Solid-State Circuits, IEEE Journal of