Title :
Sputter-deposited FeCoBC/AlNx multilayered film for wet-etching process
Author :
Tomita, H. ; Inoue, Takeru ; Mizoguchi, T. ; Sato, T.
Author_Institution :
Toshiba Corp., Kawasaki, Japan
fDate :
9/1/1999 12:00:00 AM
Abstract :
Wet-etching process of FeCoBC/AlNx multilayered thick film for planar power magnetic devices has been developed. Effects of the AlNx sputtering condition and introduction of the acid solution mixture on the possibility of the wet-etching of the multilayered film have been investigated. Even when the sputtered AlNx film had higher resistivity, the FeCoBC/AlNx multilayered film was dissolved in the acid solution mixture with a composition of 71.5 vol.%-H3PO4, 10.2 vol.%-CH3COOH, 1.9 vol.%-HNO3, 16.4 vol.%-H2O, and temperature of 50°C. A sandwich type planar power inductor was developed by using FeCoBC/AlNx multilayered film
Keywords :
aluminium compounds; cobalt alloys; etching; ferromagnetic materials; iron alloys; magnetic thin film devices; power inductors; sputter deposition; 50 degC; FeCoBC-AlN; acid solution mixture; planar power magnetic devices; resistivity; sandwich type planar power inductor; sputtering condition; wet-etching process; Amorphous materials; Magnetic devices; Magnetic films; Optical films; Semiconductor films; Sputter etching; Sputtering; Thick film inductors; Thick films; Wet etching;
Journal_Title :
Magnetics, IEEE Transactions on
