Sputter-deposited FeCoBC/AlNx multilayered film for wet-etching process

Author

Tomita, H. ; Inoue, Takeru ; Mizoguchi, T. ; Sato, T.

Author_Institution

Toshiba Corp., Kawasaki, Japan

Volume

35

Issue

5

fYear

1999

fDate

9/1/1999 12:00:00 AM

Firstpage

3571

Lastpage

3573

Abstract

Wet-etching process of FeCoBC/AlNx multilayered thick film for planar power magnetic devices has been developed. Effects of the AlNx sputtering condition and introduction of the acid solution mixture on the possibility of the wet-etching of the multilayered film have been investigated. Even when the sputtered AlNx film had higher resistivity, the FeCoBC/AlNx multilayered film was dissolved in the acid solution mixture with a composition of 71.5 vol.%-H3PO4, 10.2 vol.%-CH3COOH, 1.9 vol.%-HNO3, 16.4 vol.%-H2O, and temperature of 50°C. A sandwich type planar power inductor was developed by using FeCoBC/AlNx multilayered film

Keywords

aluminium compounds; cobalt alloys; etching; ferromagnetic materials; iron alloys; magnetic thin film devices; power inductors; sputter deposition; 50 degC; FeCoBC-AlN; acid solution mixture; planar power magnetic devices; resistivity; sandwich type planar power inductor; sputtering condition; wet-etching process; Amorphous materials; Magnetic devices; Magnetic films; Optical films; Semiconductor films; Sputter etching; Sputtering; Thick film inductors; Thick films; Wet etching;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.800593

Filename

800593