MEMS and Si micromachined circuits for high-frequency applications

Author

Katehi, Linda P B ; Harvey, James F. ; Brown, Elliott

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

Volume

50

Issue

3

fYear

2002

fDate

3/1/2002 12:00:00 AM

Firstpage

858

Lastpage

866

Abstract

RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits

Keywords

MMIC; integrated circuit packaging; micromachining; micromechanical devices; microwave antenna arrays; microwave switches; multichip modules; reviews; semiconductor device packaging; semiconductor switches; MEMS switches; MEMS technology; MMIC chips; RF MEMS devices; Si; cantilever beam switches; compliant beam switches; fixed-fixed beam switches; high-density on-wafer packaged circuits; high-frequency applications; low-cost antenna arrays; low-cost circuits; micromachined circuits; microwave scattering parameters; reconfigurable apertures; three-dimensional integration; Antenna arrays; Aperture antennas; Circuits and systems; History; Micromachining; Micromechanical devices; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Switching circuits;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.989969

Filename

989969