Title :
MEMS and Si micromachined circuits for high-frequency applications
Author :
Katehi, Linda P B ; Harvey, James F. ; Brown, Elliott
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fDate :
3/1/2002 12:00:00 AM
Abstract :
RF micromachining and microelectromechanical structure (MEMS) technology promise to provide an innovative approach in the development of effective and low-cost circuits and systems. This technology is expected to have significant application in the development of low-cost antenna arrays and reconfigurable apertures, due to its potential to support novel systems architectures. This paper presents a brief history and the state-of-the-art in the development of RF MEMS devices, with primary emphasis on switches and Si-micromachined circuit components for use in high-performance high-density on-wafer packaged circuits
Keywords :
MMIC; integrated circuit packaging; micromachining; micromechanical devices; microwave antenna arrays; microwave switches; multichip modules; reviews; semiconductor device packaging; semiconductor switches; MEMS switches; MEMS technology; MMIC chips; RF MEMS devices; Si; cantilever beam switches; compliant beam switches; fixed-fixed beam switches; high-density on-wafer packaged circuits; high-frequency applications; low-cost antenna arrays; low-cost circuits; micromachined circuits; microwave scattering parameters; reconfigurable apertures; three-dimensional integration; Antenna arrays; Aperture antennas; Circuits and systems; History; Micromachining; Micromechanical devices; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Switching circuits;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on