DocumentCode :
1260630
Title :
Efficient DSP-Higher-Order PML Formulations for the Metal Plate Buried in Dispersive Soil Half-Space Problem
Author :
Naixing Feng ; Jianxiong Li
Author_Institution :
Sch. of Electron. & Inf. Eng., Tianjin Polytech. Univ., Tianjin, China
Volume :
54
Issue :
5
fYear :
2012
Firstpage :
1178
Lastpage :
1181
Abstract :
An efficient and unsplit-field implementation of the higher order perfectly matched layer (PML) based on the stretched coordinate PML (SC-PML) formulations and digital signal processing (DSP) techniques is proposed to truncate the finite-difference time-domain (FDTD) lattices. The higher order PML has the advantages of both the conventional PML and the complex frequency-shifted PML (CFS-PML) in terms of absorbing performances. A 3-D FDTD simulation of the metal plate buried in dispersive soil half-space problem has been carried out to validate these formulations. It is shown that the proposed PML formulations with the higher order scheme are efficient in terms of attenuating both the low-frequency propagating waves and evanescent waves and reducing late-time reflections.
Keywords :
absorption; electromagnetic wave propagation; finite difference time-domain analysis; signal processing; 3D FDTD simulation; CFS-PML; FDTD lattices; SC-PML formulations; absorbing performances; complex frequency-shifted PML; digital signal processing techniques; dispersive soil half-space problem; efficient DSP-higher-order PML formulations; evanescent waves; finite-difference time-domain lattices; higher order perfectly matched layer; higher order scheme; late-time reflection reduction; low-frequency waves propagation; metal plate; signal coordinate PML; soil half-space problem; unsplit-field implementation; Dispersion; Finite difference methods; Metals; Optimized production technology; Perfectly matched layers; Soil; Time domain analysis; Digital signal processing techniques; finite-difference time-domain; perfectly matched layer;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2012.2210047
Filename :
6262469
Link To Document :
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