MEMS — BiCMOS monolithic integration

This paper presents various RF-MEMS technologies and devices integrated to a standard BiCMOS process. SiGe BiCMOS technology acts as the baseline process for the integration of modules increasing the functionality and by this way enlarging the spectrum for embedded system applications. Back-end-off-line (BEOL) integrated RF-MEMS switches for mm-wave applications, through silicon vias (TSVs) for RF-grounding and 3D integration and a fully BiCMOS integrated microchannel technology for microfluidic applications are discussed. This paper covers the aspects of both technology challenges and performances figures.