Title :
Integration of microstrip patch antenna on ceramic ball grid array package
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fDate :
2/28/2002 12:00:00 AM
Abstract :
A novel concept of integration of an antenna on an integrated circuit package is proposed for the single-chip solutions of wireless transceivers. A prototype antenna integrated on a thin ceramic ball grid array package is reported. Results show that the antenna achieved impedance bandwidth of 4.65% and radiation efficiency of 65% at 5.52 GHz
Keywords :
CMOS integrated circuits; ball grid arrays; ceramic packaging; integrated circuit packaging; microstrip antennas; mobile radio; transceivers; 5.52 GHz; 65 percent; CMOS wireless tranceiver; ceramic ball grid array package; microstrip patch antenna; prototype antenna; radiation efficiency 65%; single-chip solutions; wireless transceivers;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20020144
