Title :
An FEM analysis of the temperature rise distribution in a GMR head due to the sense current and contact resistance
Author :
Imamura, T. ; Kanai, H. ; Toda, J.
Author_Institution :
File Memory Lab., Fujitsu Labs. Ltd., Tokyo, Japan
fDate :
9/1/1999 12:00:00 AM
Abstract :
The temperature rise and heat flux distribution in GMR heads due to a sense current were investigated. Calculations considering the contact resistance agreed with the measured temperature rise within 1%. Results showed that reducing the contact resistance is as effective in lowering the temperature rise as increasing thermal conductivities of the shields and gap insulators. These factors allow higher current densities for future heads
Keywords :
contact resistance; finite element analysis; giant magnetoresistance; magnetic heads; magnetoresistive devices; temperature distribution; thermal conductivity; FEM analysis; contact resistance; giant magnetoresistive head; heat flux distribution; higher current densities; sense current; temperature rise distribution; thermal conductivity; Contact resistance; Current density; Giant magnetoresistance; Insulation; Magnetic heads; Magnetic materials; Resistance heating; Temperature distribution; Temperature sensors; Thermal conductivity;
Journal_Title :
Magnetics, IEEE Transactions on
