A constitutive model for a high lead solder

Author

Wen, Shengmin ; Keer, Leon M. ; Vaynman, Semyon ; Lawson, Lawrence R.

Author_Institution

Dept. of Civil Eng., Northwestern Univ., Evanston, IL, USA

Volume

25

Issue

1

fYear

2002

fDate

3/1/2002 12:00:00 AM

Firstpage

23

Lastpage

31

Abstract

High lead solders have been widely used in chip scale packaging. This paper presents a comprehensive study of the various properties, such as Young´s moduli, creep, plasticity, cyclic hardening and softening, fatigue, of a typical high lead solder, 96.5Pb-3.5Sn. Based on these studies, a unified creep and plasticity approach, incorporating damage, is adopted to construct a three-dimensional constitutive model for this solder. The model is then used to simulate cyclic hardening and softening behavior, isothermal and nonisothermal loading, and damage during the fatigue process. Experimental results from uniaxial tension tests are used to verify the model and good agreement has been achieved

Keywords

Young´s modulus; chip scale packaging; creep; fatigue; hardening; lead alloys; plasticity; softening (metallurgical); soldering; tin alloys; PbSn; Young´s moduli; chip scale packaging; constitutive model; creep; cyclic hardening; fatigue; fatigue process; high lead solder; isothermal loading; nonisothermal loading; plasticity; softening; three-dimensional model; uniaxial tension tests; Creep; Fatigue; Geometry; Lead; Materials testing; Softening; Substrates; Temperature; Thermal expansion; Thermal loading;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.991171

Filename

991171