DocumentCode
1263166
Title
GaN-Based LEDs With Contact-Transferred and Mask-Embedded Lithography and In-Situ N
Treatments
Author
Shei, Shih-Chang ; Yu, Chi-Fu
Author_Institution
Dept. of Electr. Eng., Nat. Univ. of Tainan, Tainan, Taiwan
Volume
30
Issue
20
fYear
2012
Firstpage
3241
Lastpage
3246
Abstract
The authors report that GaN-based LEDs with contact-transferred and mask-embedded lithography (CMEL) and in-situ N treatments were fabricated. From the experiment results, it can be seen clearly that the characteristic of ITO contacts on the etched p-GaN with the N treatment-20 sccm shows a near ohmic behavior. With 20 mA current injection, it was found that forward voltage and output power were 3.09 V and 5.16 mW for the LED with CMEL-400 nm-treatment. It was also found that we can achieve 20.5% enhancement for the LED with CMEL-400 nm and do not degrade the electrical properties of the GaN-based LEDs. Furthermore, the reliability of the proposed LED was good.
Keywords
III-V semiconductors; gallium compounds; indium compounds; light emitting diodes; lithography; masks; ohmic contacts; optical fabrication; semiconductor device reliability; tin compounds; wide band gap semiconductors; CMEL-400 nm-treatment; GaN-ITO; LED output power; contact-transferred-mask-embedded lithography; current 20 mA; current injection; electrical properties; etching; forward voltage; in-situ N2 treatments; light-emitting ITO contacts; near ohmic behavior; power 5.16 mW; reliability; voltage 3.09 V; wavelength 400 nm; Gallium nitride; Indium tin oxide; Iterative closest point algorithm; Light emitting diodes; Plasmas; Power generation; Surface treatment; GaN; light-emitting diodes (LEDs); nanoimprint; treatment;
fLanguage
English
Journal_Title
Lightwave Technology, Journal of
Publisher
ieee
ISSN
0733-8724
Type
jour
DOI
10.1109/JLT.2012.2212697
Filename
6266675
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