• DocumentCode
    1263166
  • Title

    GaN-Based LEDs With Contact-Transferred and Mask-Embedded Lithography and In-Situ N _{2} Treatments

  • Author

    Shei, Shih-Chang ; Yu, Chi-Fu

  • Author_Institution
    Dept. of Electr. Eng., Nat. Univ. of Tainan, Tainan, Taiwan
  • Volume
    30
  • Issue
    20
  • fYear
    2012
  • Firstpage
    3241
  • Lastpage
    3246
  • Abstract
    The authors report that GaN-based LEDs with contact-transferred and mask-embedded lithography (CMEL) and in-situ N treatments were fabricated. From the experiment results, it can be seen clearly that the characteristic of ITO contacts on the etched p-GaN with the N treatment-20 sccm shows a near ohmic behavior. With 20 mA current injection, it was found that forward voltage and output power were 3.09 V and 5.16 mW for the LED with CMEL-400 nm-treatment. It was also found that we can achieve 20.5% enhancement for the LED with CMEL-400 nm and do not degrade the electrical properties of the GaN-based LEDs. Furthermore, the reliability of the proposed LED was good.
  • Keywords
    III-V semiconductors; gallium compounds; indium compounds; light emitting diodes; lithography; masks; ohmic contacts; optical fabrication; semiconductor device reliability; tin compounds; wide band gap semiconductors; CMEL-400 nm-treatment; GaN-ITO; LED output power; contact-transferred-mask-embedded lithography; current 20 mA; current injection; electrical properties; etching; forward voltage; in-situ N2 treatments; light-emitting ITO contacts; near ohmic behavior; power 5.16 mW; reliability; voltage 3.09 V; wavelength 400 nm; Gallium nitride; Indium tin oxide; Iterative closest point algorithm; Light emitting diodes; Plasmas; Power generation; Surface treatment; GaN; light-emitting diodes (LEDs); nanoimprint; treatment;
  • fLanguage
    English
  • Journal_Title
    Lightwave Technology, Journal of
  • Publisher
    ieee
  • ISSN
    0733-8724
  • Type

    jour

  • DOI
    10.1109/JLT.2012.2212697
  • Filename
    6266675