• DocumentCode
    1263175
  • Title

    Humidity management of outdoor electronic equipment: methods, pitfalls, and recommendations

  • Author

    Tencer, Michal ; Moss, John Seaborn

  • Author_Institution
    Nortel Networks, Ottawa, Ont., Canada
  • Volume
    25
  • Issue
    1
  • fYear
    2002
  • fDate
    3/1/2002 12:00:00 AM
  • Firstpage
    66
  • Lastpage
    72
  • Abstract
    Discusses the basics of the three approaches to mitigation of humidity related failures namely; 1) relative humidity control module (RHCM); 2) absolute humidity control (AHCM); 3) use of potting and coating, as well as conditions and limitations of their applicability. The RHCM approach (or Saturation Limit Control) uses heat dissipation from electronics to maintain an appropriate temperature difference between ambient and the critical surfaces to lower RH in their vicinity and at same time through the use of diffusion plugs ensures a relatively fast humidity equilibration between the enclosure air and ambient to minimize condensation caused by cold fronts and radiation cooling. The AHCM approach relies on minimization of water ingress through selection of appropriate materials and design and at same time uses desiccant to remove the water which made its way into the enclosure. The choice between these schemes depends mostly on thermal considerations. The more expensive and sensitive to errors AHCM scheme has to be used when the energy dissipation is either not high enough or it is highly dependent on the traffic
  • Keywords
    coating techniques; condensation; cooling; failure analysis; humidity; packaging; absolute humidity control; coating; cold fronts; condensation; critical surfaces; desiccant; diffusion plugs; enclosure air; energy dissipation; heat dissipation; humidity management; humidity related failures; outdoor electronic equipment; potting; radiation cooling; relative humidity control module; temperature difference; water ingress; Coatings; Connectors; Degradation; Electronic equipment; Humidity control; Moisture; Printed circuits; Surface resistance; Telecommunication network reliability; Temperature control;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.991177
  • Filename
    991177