DocumentCode :
1263175
Title :
Humidity management of outdoor electronic equipment: methods, pitfalls, and recommendations
Author :
Tencer, Michal ; Moss, John Seaborn
Author_Institution :
Nortel Networks, Ottawa, Ont., Canada
Volume :
25
Issue :
1
fYear :
2002
fDate :
3/1/2002 12:00:00 AM
Firstpage :
66
Lastpage :
72
Abstract :
Discusses the basics of the three approaches to mitigation of humidity related failures namely; 1) relative humidity control module (RHCM); 2) absolute humidity control (AHCM); 3) use of potting and coating, as well as conditions and limitations of their applicability. The RHCM approach (or Saturation Limit Control) uses heat dissipation from electronics to maintain an appropriate temperature difference between ambient and the critical surfaces to lower RH in their vicinity and at same time through the use of diffusion plugs ensures a relatively fast humidity equilibration between the enclosure air and ambient to minimize condensation caused by cold fronts and radiation cooling. The AHCM approach relies on minimization of water ingress through selection of appropriate materials and design and at same time uses desiccant to remove the water which made its way into the enclosure. The choice between these schemes depends mostly on thermal considerations. The more expensive and sensitive to errors AHCM scheme has to be used when the energy dissipation is either not high enough or it is highly dependent on the traffic
Keywords :
coating techniques; condensation; cooling; failure analysis; humidity; packaging; absolute humidity control; coating; cold fronts; condensation; critical surfaces; desiccant; diffusion plugs; enclosure air; energy dissipation; heat dissipation; humidity management; humidity related failures; outdoor electronic equipment; potting; radiation cooling; relative humidity control module; temperature difference; water ingress; Coatings; Connectors; Degradation; Electronic equipment; Humidity control; Moisture; Printed circuits; Surface resistance; Telecommunication network reliability; Temperature control;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.991177
Filename :
991177
Link To Document :
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