Title :
The Relation Between Degradation Under DC and RF Stress Conditions
Author :
Scholten, Andries J. ; Stephens, Daniel ; Smit, Geert D J ; Sasse, Guido T. ; Bisschop, Jaap
Author_Institution :
NXP-TSMC Res. Center, Eindhoven, Netherlands
Abstract :
In this paper, we develop a method to derive degradation formulas for time-varying stress from the formulas for the constant-bias case, discuss its limitations, and apply it to a set of radio-frequency (RF) stress experiments. First, we will give a new derivation of the well-known power-law case without invoking any specific physical degradation model. Next, we will show that this derivation can be generalized to the broader class of degradation functions of type g(f(Vi)·t). We will illustrate our work with an example of hot-carrier degradation in 45-nm n-channel metal-oxide-semiconductor field-effect transistors, where an accurate prediction of the measured lifetime under RF stress conditions is obtained from the measured degradation under direct-current stress.
Keywords :
MOSFET; semiconductor device reliability; time-varying systems; RF stress experiment; constant-bias case; degradation derive formula; device reliability; direct-current stress; hot-carrier degradation; n-channel metal-oxide-semiconductor field-effect transistor; physical degradation model; power-law case; radio-frequency stress experiment; size 45 nm; time-varying stress; Degradation; Equations; Hot carriers; Mathematical model; Radio frequency; Reliability; Stress; Device reliability; hot-carrier degradation; negative-bias temperature instability (NBTI); radio-frequency complementary metal–oxide–semiconductor (RF CMOS); reliability;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2011.2153854