DocumentCode :
1265841
Title :
The Relation Between Degradation Under DC and RF Stress Conditions
Author :
Scholten, Andries J. ; Stephens, Daniel ; Smit, Geert D J ; Sasse, Guido T. ; Bisschop, Jaap
Author_Institution :
NXP-TSMC Res. Center, Eindhoven, Netherlands
Volume :
58
Issue :
8
fYear :
2011
Firstpage :
2721
Lastpage :
2728
Abstract :
In this paper, we develop a method to derive degradation formulas for time-varying stress from the formulas for the constant-bias case, discuss its limitations, and apply it to a set of radio-frequency (RF) stress experiments. First, we will give a new derivation of the well-known power-law case without invoking any specific physical degradation model. Next, we will show that this derivation can be generalized to the broader class of degradation functions of type g(f(Vit). We will illustrate our work with an example of hot-carrier degradation in 45-nm n-channel metal-oxide-semiconductor field-effect transistors, where an accurate prediction of the measured lifetime under RF stress conditions is obtained from the measured degradation under direct-current stress.
Keywords :
MOSFET; semiconductor device reliability; time-varying systems; RF stress experiment; constant-bias case; degradation derive formula; device reliability; direct-current stress; hot-carrier degradation; n-channel metal-oxide-semiconductor field-effect transistor; physical degradation model; power-law case; radio-frequency stress experiment; size 45 nm; time-varying stress; Degradation; Equations; Hot carriers; Mathematical model; Radio frequency; Reliability; Stress; Device reliability; hot-carrier degradation; negative-bias temperature instability (NBTI); radio-frequency complementary metal–oxide–semiconductor (RF CMOS); reliability;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2011.2153854
Filename :
5941063
Link To Document :
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