DocumentCode
1265841
Title
The Relation Between Degradation Under DC and RF Stress Conditions
Author
Scholten, Andries J. ; Stephens, Daniel ; Smit, Geert D J ; Sasse, Guido T. ; Bisschop, Jaap
Author_Institution
NXP-TSMC Res. Center, Eindhoven, Netherlands
Volume
58
Issue
8
fYear
2011
Firstpage
2721
Lastpage
2728
Abstract
In this paper, we develop a method to derive degradation formulas for time-varying stress from the formulas for the constant-bias case, discuss its limitations, and apply it to a set of radio-frequency (RF) stress experiments. First, we will give a new derivation of the well-known power-law case without invoking any specific physical degradation model. Next, we will show that this derivation can be generalized to the broader class of degradation functions of type g(f(Vi)·t). We will illustrate our work with an example of hot-carrier degradation in 45-nm n-channel metal-oxide-semiconductor field-effect transistors, where an accurate prediction of the measured lifetime under RF stress conditions is obtained from the measured degradation under direct-current stress.
Keywords
MOSFET; semiconductor device reliability; time-varying systems; RF stress experiment; constant-bias case; degradation derive formula; device reliability; direct-current stress; hot-carrier degradation; n-channel metal-oxide-semiconductor field-effect transistor; physical degradation model; power-law case; radio-frequency stress experiment; size 45 nm; time-varying stress; Degradation; Equations; Hot carriers; Mathematical model; Radio frequency; Reliability; Stress; Device reliability; hot-carrier degradation; negative-bias temperature instability (NBTI); radio-frequency complementary metal–oxide–semiconductor (RF CMOS); reliability;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2011.2153854
Filename
5941063
Link To Document