DocumentCode :
1265940
Title :
Memristors With Flexible Electronic Applications
Author :
Gergel-Hackett, Nadine ; Tedesco, Joseph L. ; Richter, Curt A.
Author_Institution :
Dept. of Chem. & Phys., Mary Baldwin Coll., Staunton, VA, USA
Volume :
100
Issue :
6
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
1971
Lastpage :
1978
Abstract :
In addition to the potential for memristors to be used in logic, memory, smart interconnects, and biologically inspired architectures that could transform traditional silicon-based computing, memristors may enable such transformative technologies on physically flexible substrates. The simple structure of a memristor, which generally consists of a thin film of oxide sandwiched between two metal contacts, contributes to its compatibility with existing and future large area flexible electronics. This is especially true considering that recent work has demonstrated the ability for titanium dioxide-based memristors to be deposited from solution at room temperature by using a sol gel technique on a flexible polymer substrate. The integration of memristors with traditional flexible devices (such as thin-film organic, zinc oxide, or amorphous-Si transistors) may enable the realization of a new paradigm in computing technology through lightweight, inexpensive, flexible electronics.
Keywords :
flexible electronics; memristors; polymers; sol-gel processing; thin film devices; biologically inspired architectures; flexible electronic applications; flexible polymer substrate; logic architectures; memory architectures; metal contacts; oxide sandwiched thin film; physically flexible substrates; silicon-based computing; smart interconnect architectures; sol gel technique; temperature 293 K to 298 K; thin film; titanium dioxide-based memristors; transformative technologies; Flexible electronics; Memristors; Nonvolatile memory; Polymers; Substrates; Switches; Switching circuits; Flexible electronics; flexible memory; memristor; resistive memory;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2011.2158284
Filename :
5942140
Link To Document :
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