Title :
Plasma-etch technology
Author :
Cotler, Tina J. ; Elta, Michael E.
Author_Institution :
Michigan Univ., Ann Arbor, MI, USA
fDate :
7/1/1990 12:00:00 AM
Abstract :
An overview is given of plasma-etch processes used in microelectronics fabrication for pattern transfer, and the main requirements for plasma-assisted etching are outlined. The two primary etch mechanisms-chemical and physical-are examined. Issues involved in bringing plasma processes to the factory are discussed. Monitoring and controlling plasma processes are considered.<>
Keywords :
process control; semiconductor technology; sputter etching; etch mechanisms; factory; microelectronics fabrication; monitoring; pattern transfer; plasma processes; plasma-assisted etching; plasma-etch processes; process control; Anisotropic magnetoresistance; Circuits; Etching; Gases; Plasma applications; Plasma chemistry; Plasma devices; Plasma materials processing; Polymer films; Silicon;
Journal_Title :
Circuits and Devices Magazine, IEEE
