Title :
Laser-fabrication for solid-state electronics
Author_Institution :
Dept. of Electr. & Appl. Eng., Columbia Univ., New York, NY, USA
Abstract :
Three fabrication procedures used in laser processing are described, and the characteristics that make ultraviolet laser sources useful in these techniques are examined. The use of UV lasers for VLSI metallization, ultrashallow doping, in-situ processing, and electronic packaging is discussed. Writing with a tightly focused beam is also considered, for both repair and fabrication purposes.<>
Keywords :
VLSI; integrated circuit technology; laser beam applications; metallisation; packaging; semiconductor doping; VLSI metallization; electronic packaging; fabrication procedures; laser processing; repair; solid-state electronics; tightly focused beam; ultrashallow doping; ultraviolet laser sources; writing; Chemical lasers; Etching; Laser beams; Laser transitions; Optical device fabrication; Optical films; Semiconductor lasers; Solid lasers; Solid state circuits; Substrates;
Journal_Title :
Circuits and Devices Magazine, IEEE
