DocumentCode
1266546
Title
Laser-fabrication for solid-state electronics
Author
Osgood, R.M.
Author_Institution
Dept. of Electr. & Appl. Eng., Columbia Univ., New York, NY, USA
Volume
6
Issue
5
fYear
1990
Firstpage
25
Lastpage
31
Abstract
Three fabrication procedures used in laser processing are described, and the characteristics that make ultraviolet laser sources useful in these techniques are examined. The use of UV lasers for VLSI metallization, ultrashallow doping, in-situ processing, and electronic packaging is discussed. Writing with a tightly focused beam is also considered, for both repair and fabrication purposes.<>
Keywords
VLSI; integrated circuit technology; laser beam applications; metallisation; packaging; semiconductor doping; VLSI metallization; electronic packaging; fabrication procedures; laser processing; repair; solid-state electronics; tightly focused beam; ultrashallow doping; ultraviolet laser sources; writing; Chemical lasers; Etching; Laser beams; Laser transitions; Optical device fabrication; Optical films; Semiconductor lasers; Solid lasers; Solid state circuits; Substrates;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.59442
Filename
59442
Link To Document