Title :
Integrated test chips improve IC assembly
Author_Institution :
Sandia Nat. Lab., Albuquerque, NM, USA
Abstract :
The use of test dies integrated with a semiconductor wafer to gauge environmental stresses effectively during the packaging and processing phases is discussed. These special-purpose assembly test chips (ATCs) are designed primarily for studying failures of the package-centered and composite types. These chips usually provide a way to stress the die, and they include transducers for monitoring the die´s response to the stress. A variety of structures has been used to measure parameters associated with package-related failures. Corrosion detectors, moisture detectors, mechanical stress sensors, mobile ion sensors, thermal resistance measurement circuits, and multifunction test chips are examined.<>
Keywords :
corrosion testing; electric sensing devices; environmental testing; failure analysis; integrated circuit testing; microassembling; packaging; thermal resistance measurement; IC assembly; corrosion detectors; environmental stresses; failures; mechanical stress sensors; mobile ion sensors; moisture detectors; multifunction test chips; package-related failures; packaging; semiconductor wafer; test dies; thermal resistance measurement; transducers; Assembly; Circuit testing; Detectors; Electrical resistance measurement; Integrated circuit testing; Mechanical sensors; Semiconductor device packaging; Semiconductor device testing; Thermal sensors; Thermal stresses;
Journal_Title :
Circuits and Devices Magazine, IEEE
