Title :
Measuring Signal Integrity
Author_Institution :
Comput. Aided Circuit Design Group, Friedrich-Alexander-Univ. Erlangen-Nuremberg, Erlangen, Germany
Abstract :
This article explains mechanisms and parameters that are relevant for signal integrity, illustrates their individual impact, and introduces typical measurement methods for signal integrity parameters in frequency and time domain. These methods are compared with respect to their specific strengths and limitations. Results from practical applications will be demonstrated including printed circuit boards (PCBs), cables, and signal paths with several discontinuities. The demonstrated methods range from impedance profiling over loss parameter extraction to eye diagram prediction for application signals.
Keywords :
integrated circuit design; integrated circuit interconnections; printed circuits; time-domain analysis; cables; impedance profiling; printed circuit boards; signal integrity; signal paths; Measurement; Quality assessment; Signal analysis; Signal processing;
Journal_Title :
Microwave Magazine, IEEE
DOI :
10.1109/MMM.2011.941415