Title :
Optoelectronic/VLSI
Author :
Goossen, Keith W.
Author_Institution :
Bell Labs., Lucent Technol., Holmdel, NJ, USA
fDate :
11/1/1999 12:00:00 AM
Abstract :
Technology is presented for placing thousands of surface-normal input and output optoelectronic devices onto very large scale integration (VLSI) chips. This enables optical means of bringing information onto and off of an integrated circuit (IC), supplanting electrical means such as wire-bonds
Keywords :
VLSI; integrated circuit packaging; integrated optoelectronics; optical interconnections; smart pixels; optical interconnects; smart pixel chips; surface-normal input optoelectronic devices; surface-normal output optoelectronic devices; very large scale integration; Absorption; Excitons; Integrated optics; Optical interconnections; Optical modulation; Optoelectronic devices; Photonic band gap; Photonic integrated circuits; Semiconductor device packaging; Very large scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.803446
