DocumentCode
1268039
Title
Temperature Drift Compensation Technique for Substrate Integrated Waveguide Oscillator
Author
Djerafi, Tarek ; Wu, Ke ; Deslandes, Dominic
Author_Institution
INRS-EMT, Montreal, QC, Canada
Volume
22
Issue
9
fYear
2012
Firstpage
489
Lastpage
491
Abstract
In this letter, a temperature drift compensation technique for Substrate Integrated Waveguide (SIW) oscillator is proposed. The drift compensation is achieved with the use of an appropriate ratio between the coefficient of thermal expansion and the thermal coefficient of the permittivity. A cavity is first designed and measured to demonstrate the potential of the proposed technique. Measured performances are compared to those for other cavities of different substrates. An oscillator, based on an SIW cavity, is designed and fabricated at 10 GHz to validate the application of the proposed technique. Measured results show a stability of 2 ppm/°C in the temperature operating range of -40 to 80°C.
Keywords
microwave oscillators; permittivity; substrate integrated waveguides; thermal expansion; SIW cavity; frequency 10 GHz; permittivity; substrate integrated waveguide oscillator; temperature -40 degC to 80 degC; temperature drift compensation technique; thermal coefficient; thermal expansion; Cavity resonators; Oscillators; Permittivity; Resonant frequency; Substrates; Temperature measurement; Thermal stability; Cavity; coefficient of thermal expansion (CTE); equivalent linear frequency drift; oscillator; substrate integrated waveguide (SIW); temperature compensation;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2012.2211340
Filename
6275447
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