DocumentCode
1270229
Title
Figures of merit to characterize the importance of on-chip inductance
Author
Ismail, Yehea I. ; Friedman, Eby G. ; Neves, Jose L.
Author_Institution
Dept. of Electr. Eng., Rochester Univ., NY, USA
Volume
7
Issue
4
fYear
1999
Firstpage
442
Lastpage
449
Abstract
A closed-form solution for the output signal of a CMOS inverter driving an RLC transmission line is presented. This solution is based on the alpha power law for deep submicrometer technologies. Two figures of merit are presented that are useful for determining if a section of interconnect should be modeled as either an RLC or an RC impedance. The damping factor of a lumped RLC circuit is shown to be a useful criterion. The second useful figure of merit considered in this paper is the ratio of the rise time of the input signal at the driver of an interconnect line to the time of flight of the signals across the line. AS/X circuit simulations of an RLC transmission line and a five section RC II circuit based on a 0.25-/spl mu/m IBM CMOS technology are used to quantify and determine the relative accuracy of an RC model. One primary result of this paper is evidence demonstrating that a range for the length of the interconnect exists for which inductance effects are prominent. Furthermore, it is shown that under certain conditions, inductance effects are negligible despite the length of the section of interconnect.
Keywords
CMOS logic circuits; VLSI; circuit simulation; inductance; integrated circuit interconnections; integrated circuit modelling; logic gates; lumped parameter networks; transmission line theory; AS/X circuit simulations; CMOS inverter; RC model; RLC transmission line; alpha power law; closed-form solution; damping factor; deep submicrometer technologies; figures of merit; five section RC II circuit; input signal rise time; interconnect section modelling; lumped RLC circuit; on-chip inductance; output signal; time of flight; CMOS technology; Closed-form solution; Damping; Impedance; Inductance; Integrated circuit interconnections; Inverters; Power transmission lines; RLC circuits; Semiconductor device modeling;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/92.805751
Filename
805751
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