DocumentCode :
1270998
Title :
The solderless package concept
Author :
Notley, D.S.
Author_Institution :
Varelco Ltd., Newmarket, UK
Volume :
27
Issue :
9
fYear :
1981
fDate :
9/1/1981 12:00:00 AM
Firstpage :
640
Lastpage :
641
fLanguage :
English
Journal_Title :
Electronics and Power
Publisher :
iet
ISSN :
0013-5127
Type :
jour
DOI :
10.1049/ep.1981.0297
Filename :
5185632
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1270998
