Title :
Mid-air interactions above stereoscopic interactive tables
Author :
Mendes, Daniel ; Fonseca, Fernando ; Araujo, Bilza ; Ferreira, Andre ; Jorge, J.
Author_Institution :
INESC-ID Lisbon, Univ. of Lisbon, Lisbon, Portugal
Abstract :
Stereoscopic tabletops offer unique visualization capabilities, enabling users to perceive virtual objects as if they were lying above the surface. While allowing virtual objects to coexist with user actions in the physical world, interaction with these virtual objects above the surface presents interesting challenges. In this paper, we aim to understand which approaches to 3D virtual object manipulations are suited to this scenario. To this end, we implemented five different techniques based on the literature. Four are mid-air techniques, while the remainder relies on multi-touch gestures, which act as a baseline. Our setup combines affordable non-intrusive tracking technologies with a multi-touch stereo tabletop, providing head and hands tracking, to improve both depth perception and seamless interactions above the table. We conducted a user evaluation to find out which technique appealed most to participants. Results suggest that mid-air interactions, combining direct manipulation with six degrees of freedom for the dominant hand, are both more satisfying and efficient than the alternatives tested.
Keywords :
data visualisation; interactive systems; touch sensitive screens; virtual reality; visual perception; 3D virtual object manipulations; depth perception; hands tracking; head tracking; mid-air interactions; multitouch gestures; multitouch stereo tabletop; nonintrusive tracking technologies; seamless interactions; stereoscopic interactive tables; stereoscopic tabletops; visualization capabilities; Cameras; Educational institutions; Head; Solid modeling; Stereo image processing; Three-dimensional displays; Visualization; 3D virtual object manipulation; interactive tabletops; mid-air interactions; stereoscopic environments;
Conference_Titel :
3D User Interfaces (3DUI), 2014 IEEE Symposium on
Conference_Location :
Minneapolis, MN
DOI :
10.1109/3DUI.2014.6798833