Title :
Fiber-array pigtailing and packaging of an InP-based optical cross-connect chip
Author :
Van Zantvoort, Johan H C ; Huijskens, Frans M. ; Herben, Chretien G P ; De Waardt, Huig
Author_Institution :
Fac. of Electr. Eng. Electro-Opt. Commun., Tech. Univ. of Eindhoven, Netherlands
Abstract :
A method of coupling six single-mode fiber tapers with 250-μm spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5°C to 45°C
Keywords :
III-V semiconductors; indium compounds; integrated circuit packaging; optical fibre couplers; optical interconnections; optical planar waveguides; 250 mum; 5 to 45 C; IC testing; InP; InP-based integrated optical cross-connect chip; InP-based optical cross-connect chip packaging; ambient temperature range; chip temperature control; complete pigtailed chip assembly; fiber-array pigtailing; single-mode fiber tapers; Optical coupling; Optical fiber polarization; Optical fiber testing; Optical fibers; Optical interferometry; Optical planar waveguides; Optical refraction; Optical variables control; Optical waveguides; Packaging;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/2944.806749
