• DocumentCode
    1273165
  • Title

    High-Holding-Voltage Silicon-Controlled Rectifier for ESD Applications

  • Author

    Dong, Shurong ; Wu, Jian ; Miao, Meng ; Zeng, Jie ; Han, Yan ; Liou, Juin J.

  • Author_Institution
    Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China
  • Volume
    33
  • Issue
    10
  • fYear
    2012
  • Firstpage
    1345
  • Lastpage
    1347
  • Abstract
    Low-voltage-triggering silicon-controlled rectifier (LVTSCR) having a gate structure can offer a low trigger voltage in electrostatic discharge (ESD) applications. To avoid the threat of latch-up, the lateral width of LVTSCR is often stretched to obtain a relatively high holding voltage. The resulting lateral dimension increase, however, enlarges the size of LVTSCR. In this letter, a new method to increase the holding voltage of LVTSCR is developed. It is based on adding a floating-n-well region in the LVTSCR and can increase the holding voltage without requiring additional layout area. Furthermore, with this new LVTSCR, it is possible to implement an ESD protection operation within a very small window of 1 V.
  • Keywords
    electrostatic discharge; thyristors; ESD protection operation; LVTSCR; electrostatic discharge applications; floating-n-well region; gate structure; high-holding-voltage silicon-controlled rectifier; lateral dimension; lateral width; low-voltage-triggering silicon-controlled rectifier; voltage 1 V; Bipolar transistors; CMOS integrated circuits; CMOS process; Electrostatic discharges; Logic gates; Thyristors; Electrostatic discharge (ESD); floating n-well (FN); silicon-controlled rectifier (SCR);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2208934
  • Filename
    6286984