Title :
Empirical analysis on technology integration capability and its components based on integration process
Author :
Guo Liang ; Cui Song ; Yu Bo
Author_Institution :
Sch. of Manage., Harbin Inst. of Technol., Harbin, China
Abstract :
With the continuing increase of economic environment development level and upgrading of product structure, effective technology integration could help enterprises better implement independent innovation. Basing on deeply analyses of the definition of technology integration capability, this study constructs a structure model of technology integration capability, which consists of product architecture competence, technology selection capability, technology absorptive capacity and technology reconfiguration capability from the view of integration process, then sets up measurement model for technology integration capability, finally the study carries out empirical analysis to verify feasibility and applicability of the model. While boosting related theoretical research, this study also focuses on setting up a measure of cultivating and improving the technology integration capability so as to provide theoretical reference and practical countermeasures on how to effectively adjust the way of integration innovation and ultimately increase enterprises comprehensive competitive advantage.
Keywords :
innovation management; organisational aspects; technology management; economic environment development; empirical analysis; independent innovation; integration innovation; integration process; product architecture competence; product structure; technology absorptive capacity; technology integration capability; technology selection capability; theoretical research; Analytical models; Architecture; Educational institutions; Product development; Reliability; Research and development; Technological innovation; dynamic capability; independent innovation; integration process; technology integration capability;
Conference_Titel :
Management Science & Engineering (ICMSE), 2014 International Conference on
Conference_Location :
Helsinki
Print_ISBN :
978-1-4799-5375-2
DOI :
10.1109/ICMSE.2014.6930414