DocumentCode :
1273278
Title :
Three-Dimensional Stacked Multilayer Graphene Interconnects
Author :
Yu, Tianhua ; Liang, Chen-Wei ; Kim, Changdong ; Song, Eui-Sang ; Yu, Bin
Author_Institution :
Coll. of Nanoscale Sci. & Eng., State Univ. of New York, Albany, NY, USA
Volume :
32
Issue :
8
fYear :
2011
Firstpage :
1110
Lastpage :
1112
Abstract :
We experimentally demonstrate stacked multilayer graphene (MLG) (s-MLG) as a new material system for high-performance carbon interconnects. Electrical performance is systematically characterized. We discover that the wire sheet resistance of s-MLG decreases with more layers stacking and shows better conductivity than that of the exfoliated MLG sample with the same layer numbers. The contact resistance of the s-MLG samples was calculated and confirmed using two different methods. It is demonstrated that a decrease in the intrinsic resistivity of s-MLG with increasing layer number is discovered; however, contact resistance will be saturated with more stacked layer numbers.
Keywords :
contact resistance; electrical conductivity; electrical resistivity; graphene; integrated circuit interconnections; multilayers; conductivity; contact resistance; electrical performance; high-performance carbon interconnects; intrinsic resistivity; material system; s-MLG; three-dimensional stacked multilayer graphene interconnects; wire sheet resistance; Conductivity; Contact resistance; Copper; Electrical resistance measurement; Nonhomogeneous media; Resistance; Wires; Contact resistivity; interconnect; sheet resistance; stacked multilayer graphene (s-MLG);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2158385
Filename :
5954153
Link To Document :
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