Thin-Film High-Rejection Filter Integration in Low-Loss Organic Substrate

Author

Hwang, Seunghyun ; Min, Sunghwan ; Swaminathan, Madhavan ; Sundaram, Venky ; Tummala, Rao

Author_Institution

Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

Issue

8

fYear

2011

Firstpage

1160

Lastpage

1170

Abstract

This paper presents thin-film high-rejection band pass filters integrated into organic substrate technology called RXP. A circuit topology based on unique resonator and grounding inductor is proposed. The proposed circuit provides design freedom of locating transmission zeros at lower and upper stopbands relative to the center frequency. About 2.4 GHz narrow band (<;200 MHz) and 5 GHz wide band (>;1 GHz) bandpass filters have been implemented in four-metal layer with 0.191 mm thin RXP substrate. The measured results show good agreement with simulations.

Keywords

band-pass filters; inductors; network topology; resonators; system-on-package; RXP substrate; RXP technology; circuit topology; four-metal layer; grounding inductor; low-loss organic substrate; organic substrate technology; resonator; thin-film high-rejection band pass filter; transmission zero; Band pass filters; Filtering theory; Grounding; Impedance; Inductors; Substrates; Bandpass filters; RXP; lumped-element; multilayer; organic; stopband rejection;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2011.2142398

Filename

5954163