DocumentCode :
1273345
Title :
Thermal micromagnetic model with a pseudo-three-dimensional junction for magnetoresistive heads
Author :
Chen, Lujun ; Giusti, Jim ; Fernandez-de-Castro, Juan
Author_Institution :
Seagate Technol. LLC, Bloomington, MN, USA
Volume :
38
Issue :
2
fYear :
2002
fDate :
3/1/2002 12:00:00 AM
Firstpage :
1395
Lastpage :
1404
Abstract :
We developed a pseudo-three-dimensional (3D) thermal model in conjunction with a thermal micromagnetic model to study the performance of magnetoresistive (MR) readers. With decreasing sensor dimensions, the junction plays an important role in the overall sensor response. With an image method, we converted the 3D thermal problem to a set of coupled nonlinear differential-integral equations in three regions: sensor stack region, junction region, and lead region. Analytic methods for each region allow a speedy solution for rapid development in MR head design and performance analysis, such as numerical design of experiments and regression for design optimization, Monte Carlo analysis, and statistical analysis for product yield
Keywords :
Monte Carlo methods; design engineering; design of experiments; differential equations; giant magnetoresistance; integral equations; magnetic heads; spin valves; thermal analysis; 3D thermal problem; GMR heads; MR head design; MR head performance analysis; MR readers; Monte Carlo analysis; analytic methods; coupled nonlinear differential-integral equations; design optimization; image method; junction region; lead region; magnetoresistive heads; magnetoresistive readers; numerical design of experiment; product yield; pseudo-3D junction; pseudo-3D thermal model; regression; sensor dimensions; sensor response; sensor stack region; spin valve; statistical analysis; thermal micromagnetic model; Couplings; Differential equations; Image converters; Image sensors; Magnetic sensors; Magnetoresistance; Micromagnetics; Nonlinear equations; Performance analysis; Thermal sensors;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.996034
Filename :
996034
Link To Document :
بازگشت