DocumentCode :
1273521
Title :
Trends in semiconductor packaging
Author :
Gross, D.R.
Author_Institution :
BPA(Technology & Management) Ltd., Dorking, UK
Volume :
28
Issue :
10
fYear :
1982
fDate :
10/1/1982 12:00:00 AM
Firstpage :
694
Lastpage :
697
Abstract :
For almost 20 years the dual-inline package has been dominant in electronics assembly. The development of alternative packages for today´s complex ICs means that their days in this position may be numbered
fLanguage :
English
Journal_Title :
Electronics and Power
Publisher :
iet
ISSN :
0013-5127
Type :
jour
DOI :
10.1049/ep.1982.0345
Filename :
5186126
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1273521
