InP-HBT chip-set for 40-Gb/s fiber optical communication systems operational at 3 V

Author

Mokhtari, Mehran ; Swahn, Thomas ; Walden, Robert H. ; Stanchina, William E. ; Kardos, Michael ; Juhola, Tarja ; Schuppener, Gerd ; Tenhunen, Hannu ; Lewin, Thomas

Author_Institution

KTH-Electron., R. Inst. of Technol., Kista, Sweden

Volume

32

Issue

9

fYear

1997

fDate

9/1/1997 12:00:00 AM

Firstpage

1371

Lastpage

1383

Abstract

A chip set for a 40 Gb/s fiber optical communication system has been designed and fabricated. On-wafer measurements have been performed to verify circuit operations. As far as available measurement capabilities show, all circuits are functionally fulfilling specifications for 10 Gb/s operation at less than or equal to 3 V supply voltage. During the design phase especially the influence of interconnects on signal integrity was investigated and the results were implemented for automatic extraction. All the circuits were operational after the first processing round. No redesign was necessary

Keywords

III-V semiconductors; bipolar integrated circuits; demultiplexing equipment; digital communication; heterojunction bipolar transistors; indium compounds; integrated circuit interconnections; multiplexing equipment; optical communication equipment; optical fibre communication; time division multiplexing; timing; very high speed integrated circuits; wideband amplifiers; 3 V; 40 Gbit/s; InP; InP HBT chip-set; automatic extraction; fiber optical communication systems; interconnects; on-wafer measurements; signal integrity; Clocks; Heterojunction bipolar transistors; High speed optical techniques; Integrated circuit interconnections; Integrated circuit technology; Multiplexing; Optical amplifiers; Optical fiber amplifiers; Optical fiber communication; Semiconductor device measurement;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/4.628743

Filename

628743