DocumentCode :
1275145
Title :
Connective fault tolerance in multiple bus systems
Author :
Ku, Hung-Kuei ; Hayes, John P.
Author_Institution :
AT&T Bell Labs., Middletown, NJ, USA
Volume :
8
Issue :
6
fYear :
1997
fDate :
6/1/1997 12:00:00 AM
Firstpage :
574
Lastpage :
586
Abstract :
We present an efficient approach to characterizing the fault tolerance of multiprocessor systems that employ multiple shared buses for interprocessor communication. Of concern is connective fault tolerance, which is defined as the ability to maintain communication between any two fault-free processors in the presence of faulty processors, buses, or processor-bus links. We introduce a model called processor-bus-link (PBL) graphs to represent a multiple-bus system´s interconnection structure. The model is more general than previously proposed models, and has the advantages of simple representation, broad application, and the ability to model partial bus failures. The PBL graph implies a set of component adjacency graphs that highlights various connectivity features of the system. Using these graphs, we propose a method for analyzing the maximum number of faults a multiple-bus system can tolerate, and for identifying every minimum set of faulty components that disconnects the processors of the system. We also analyze the connective fault tolerance of several proposed multiple-bus systems to illustrate the application of our method
Keywords :
fault tolerant computing; graph theory; hypercube networks; multiprocessor interconnection networks; parallel architectures; reliability; connective fault tolerance; fault-free processors; faulty processors; interconnection structure; interprocessor communication; multiple bus systems; multiple shared buses; multiprocessor systems; partial bus failures; processor-bus-link graphs; Bandwidth; Computer architecture; Costs; Degradation; Fault diagnosis; Fault tolerance; Fault tolerant systems; Hardware; Multiprocessing systems; Sun;
fLanguage :
English
Journal_Title :
Parallel and Distributed Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1045-9219
Type :
jour
DOI :
10.1109/71.595574
Filename :
595574
Link To Document :
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