• DocumentCode
    1275597
  • Title

    Test and reliability: partners in IC manufacturing. 2

  • Author

    Hawkins, Charles F. ; Segura, Jaume ; Soden, Jerry ; Dellin, Ted

  • Author_Institution
    New Mexico Univ., Albuquerque, NM, USA
  • Volume
    16
  • Issue
    4
  • fYear
    1999
  • Firstpage
    66
  • Lastpage
    73
  • Abstract
    This article discusses the major gate oxide failure modes, reliability modeling, burn-in, and qualification testing. We present a typical method to calculate failure rates
  • Keywords
    integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; IC manufacturing; burn-in technology; failure rates; gate oxide failure modes; qualification testing; reliability modeling; Bonding; Dielectric substrates; Electron traps; Failure analysis; Hot carriers; Hydrogen; Integrated circuit modeling; Integrated circuit testing; Semiconductor device modeling; Virtual manufacturing;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.808215
  • Filename
    808215
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1275597