Title :
Test and reliability: partners in IC manufacturing. 2
Author :
Hawkins, Charles F. ; Segura, Jaume ; Soden, Jerry ; Dellin, Ted
Author_Institution :
New Mexico Univ., Albuquerque, NM, USA
Abstract :
This article discusses the major gate oxide failure modes, reliability modeling, burn-in, and qualification testing. We present a typical method to calculate failure rates
Keywords :
integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; IC manufacturing; burn-in technology; failure rates; gate oxide failure modes; qualification testing; reliability modeling; Bonding; Dielectric substrates; Electron traps; Failure analysis; Hot carriers; Hydrogen; Integrated circuit modeling; Integrated circuit testing; Semiconductor device modeling; Virtual manufacturing;
Journal_Title :
Design & Test of Computers, IEEE
