• DocumentCode
    1276080
  • Title

    Bridged-Grain Solid-Phase-Crystallized Polycrystalline-Silicon Thin-Film Transistors

  • Author

    Zhou, Wei ; Meng, Zhiguo ; Zhao, Shuyun ; Zhang, Meng ; Chen, Rongsheng ; Wong, Man ; Kwok, Hoi-Sing

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • Volume
    33
  • Issue
    10
  • fYear
    2012
  • Firstpage
    1414
  • Lastpage
    1416
  • Abstract
    Novel bridged-grain (BG) technique is applied in the fabrication of low-temperature solid-phase-crystallized polycrystalline-silicon thin-film transistors. As a result of improved current flow and reduction of high drain electric field, the subthreshold slope, threshold voltage, maximum field-effect mobility, leakage current, and on-off ratio are greatly improved. Mechanisms of BG conduction are studied in detail.
  • Keywords
    cryogenic electronics; elemental semiconductors; silicon; thin film transistors; BG conduction; Si; bridged-grain technique; high drain electric held; improved current flow; leakage current; low-temperature solid-phase-crystallized thin film transistors; maximum held-effect mobility; on-off ratio; polycrystalline-silicon thin-film transistors; subthreshold slope; threshold voltage; Crystallization; Grain size; Leakage current; Silicon; Thin film transistors; Bridged grain (BG); polycrystalline silicon (poly-Si); thin-film transistors (TFTs);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2210019
  • Filename
    6290340