DocumentCode
1277251
Title
Electrothermal modeling and measurement for spatial power combining at millimeter wavelengths
Author
Batty, William ; Panks, Andrew J ; Johnson, Robert G. ; Snowden, Christopher M.
Author_Institution
Inst. of Microwaves & Photonics, Leeds Univ., UK
Volume
47
Issue
12
fYear
1999
fDate
12/1/1999 12:00:00 AM
Firstpage
2574
Lastpage
2585
Abstract
In this paper, the first completely physical coupled electrothermal model, suitable for large-signal simulation of MESFET- and HEMT-based MMIC´s and MMIC arrays, on a timescale suitable for computer-aided design, is presented. The model is validated experimentally by high-resolution thermal imaging of a MMIC 38-GHz three-stage balanced amplifier, mounted on a Cu/FR-4 substrate and cooled entirely by natural convection and radiation into free space
Keywords
HEMT integrated circuits; MESFET integrated circuits; MMIC power amplifiers; arrays; circuit simulation; differential amplifiers; field effect MIMIC; millimetre wave power amplifiers; power combiners; thermal management (packaging); thermal resistance; 38 GHz; Cu/FR-4 substrate; HEMT-based MMIC; MESFET-based MMIC; MMIC arrays; MMIC three-stage balanced amplifier; computer-aided design; free space radiation; global thermal description; high-resolution thermal imaging; large-signal simulation; millimeter wavelengths; natural convection; physical coupled electrothermal model; spatial power combining; thermal-resistance matrix; Electrothermal effects; Frequency; High power amplifiers; MESFETs; MMICs; Millimeter wave measurements; Millimeter wave radar; Power measurement; Thermal management; Wavelength measurement;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.809009
Filename
809009
Link To Document