• DocumentCode
    1277639
  • Title

    Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

  • Author

    Yeh, Jer-Liang Andrew ; Jiang, Hongrui ; Tien, Norman C.

  • Author_Institution
    Cornell Univ., Ithaca, NY, USA
  • Volume
    8
  • Issue
    4
  • fYear
    1999
  • fDate
    12/1/1999 12:00:00 AM
  • Firstpage
    456
  • Lastpage
    465
  • Abstract
    This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining
  • Keywords
    electrostatic actuators; elemental semiconductors; micromachining; silicon; sputter etching; torsion; Si; bulk silicon micromachining; deep reactive ion etching; electrostatic torsional actuator; fabrication; polysilicon surface micromachining; Anisotropic magnetoresistance; Biomembranes; Electrostatic actuators; Etching; Fabrication; Fingers; Micromachining; Resonant frequency; Silicon; Surface topography;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.809061
  • Filename
    809061