DocumentCode
1277639
Title
Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator
Author
Yeh, Jer-Liang Andrew ; Jiang, Hongrui ; Tien, Norman C.
Author_Institution
Cornell Univ., Ithaca, NY, USA
Volume
8
Issue
4
fYear
1999
fDate
12/1/1999 12:00:00 AM
Firstpage
456
Lastpage
465
Abstract
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining
Keywords
electrostatic actuators; elemental semiconductors; micromachining; silicon; sputter etching; torsion; Si; bulk silicon micromachining; deep reactive ion etching; electrostatic torsional actuator; fabrication; polysilicon surface micromachining; Anisotropic magnetoresistance; Biomembranes; Electrostatic actuators; Etching; Fabrication; Fingers; Micromachining; Resonant frequency; Silicon; Surface topography;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.809061
Filename
809061
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