DocumentCode :
1278554
Title :
Experimental investigation of vibration of the shadow mask with different assembly conditions
Author :
Wang, Wei-Chung ; Lai, Kai-Hang
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume :
45
Issue :
4
fYear :
1999
fDate :
11/1/1999 12:00:00 AM
Firstpage :
1046
Lastpage :
1056
Abstract :
In this paper, for different assembly conditions, the natural frequencies, mode shapes and amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI) fringe patterns of the shadow mask were obtained and used to visualize the difference among the assembly conditions. Specimens of three groups including one original design, adding welds along the rims of the shadow mask in the direction of the horizontal axis and changing the thickness of the plate spring were investigated. From the AF-ESPI results, except the mode 3, the natural frequencies are increased by adding welding points along the rims in the direction of the horizontal axis. For the case of increasing the thickness of the plate spring, the natural frequencies of all modes are increased. Generally speaking, adding welds improve the vibration behavior for the third, fourth and fifth modes. The first and second modes, however, are predominated by the shadow mask. In addition, the vibration characteristics of the sixth mode is not improved by changing the assembly conditions.
Keywords :
CCD image sensors; assembling; display instrumentation; dynamic testing; electronic speckle pattern interferometry; welding; CCD camera; CRT; amplitude fluctuation; assembly conditions; electronic speckle pattern interferometry; experimental investigation; fringe patterns; modal testing method; mode shapes; natural frequencies; plate spring thickness; shadow mask vibration; welds; Assembly; Etching; Interferometry; Large Hadron Collider; Mechanical engineering; Shape; Springs; Testing; Vibrations; Welding;
fLanguage :
English
Journal_Title :
Consumer Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0098-3063
Type :
jour
DOI :
10.1109/30.809181
Filename :
809181
Link To Document :
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