DocumentCode :
1278713
Title :
To suppress UV damage on the subthreshold characteristic of TFT during hydrogenation for high density TFT SRAM
Author :
Lee, K.Y. ; Fang, Y.K. ; Chen, C.W. ; Hwang, K.C. ; Liang, M.S. ; Wuu, S.G.
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume :
18
Issue :
1
fYear :
1997
Firstpage :
4
Lastpage :
6
Abstract :
In this letter, we find an efficient way to suppress UV damage on the characteristics of polysilicon thin-film transistors (TFTs) during hydrogenation for high density TFT SRAM. Polysilicon TFT can be free from UV damage during hydrogenation if the channel region is shielded by a metal line of the same width as channel. After hydrogenation, the metal shielded TFT shows an excellent subthreshold swing of 112 mV/dec, and the leakage current can be as low as 20 fA while the unshielded TFT shows a subthreshold swing of 220 mV/dec and a leakage current of 0.33 pA. This gives almost 200% improvement in subthreshold swing and one order of magnitude reduction in leakage current.
Keywords :
MOS memory circuits; SRAM chips; integrated circuit reliability; leakage currents; passivation; thin film transistors; 0.33 pA; 20 fA; Si; TFT; UV damage; channel region; high density SRAM; hydrogenation; leakage current; metal line; subthreshold characteristic; subthreshold swing; unshielded TFT; Grain boundaries; Leakage current; Liquid crystal displays; Plasma applications; Plasma measurements; Random access memory; Silicon; Thin film transistors; Threshold voltage; Tin;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.553058
Filename :
553058
Link To Document :
بازگشت