DocumentCode
1278713
Title
To suppress UV damage on the subthreshold characteristic of TFT during hydrogenation for high density TFT SRAM
Author
Lee, K.Y. ; Fang, Y.K. ; Chen, C.W. ; Hwang, K.C. ; Liang, M.S. ; Wuu, S.G.
Author_Institution
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume
18
Issue
1
fYear
1997
Firstpage
4
Lastpage
6
Abstract
In this letter, we find an efficient way to suppress UV damage on the characteristics of polysilicon thin-film transistors (TFTs) during hydrogenation for high density TFT SRAM. Polysilicon TFT can be free from UV damage during hydrogenation if the channel region is shielded by a metal line of the same width as channel. After hydrogenation, the metal shielded TFT shows an excellent subthreshold swing of 112 mV/dec, and the leakage current can be as low as 20 fA while the unshielded TFT shows a subthreshold swing of 220 mV/dec and a leakage current of 0.33 pA. This gives almost 200% improvement in subthreshold swing and one order of magnitude reduction in leakage current.
Keywords
MOS memory circuits; SRAM chips; integrated circuit reliability; leakage currents; passivation; thin film transistors; 0.33 pA; 20 fA; Si; TFT; UV damage; channel region; high density SRAM; hydrogenation; leakage current; metal line; subthreshold characteristic; subthreshold swing; unshielded TFT; Grain boundaries; Leakage current; Liquid crystal displays; Plasma applications; Plasma measurements; Random access memory; Silicon; Thin film transistors; Threshold voltage; Tin;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.553058
Filename
553058
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