• DocumentCode
    1278713
  • Title

    To suppress UV damage on the subthreshold characteristic of TFT during hydrogenation for high density TFT SRAM

  • Author

    Lee, K.Y. ; Fang, Y.K. ; Chen, C.W. ; Hwang, K.C. ; Liang, M.S. ; Wuu, S.G.

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    18
  • Issue
    1
  • fYear
    1997
  • Firstpage
    4
  • Lastpage
    6
  • Abstract
    In this letter, we find an efficient way to suppress UV damage on the characteristics of polysilicon thin-film transistors (TFTs) during hydrogenation for high density TFT SRAM. Polysilicon TFT can be free from UV damage during hydrogenation if the channel region is shielded by a metal line of the same width as channel. After hydrogenation, the metal shielded TFT shows an excellent subthreshold swing of 112 mV/dec, and the leakage current can be as low as 20 fA while the unshielded TFT shows a subthreshold swing of 220 mV/dec and a leakage current of 0.33 pA. This gives almost 200% improvement in subthreshold swing and one order of magnitude reduction in leakage current.
  • Keywords
    MOS memory circuits; SRAM chips; integrated circuit reliability; leakage currents; passivation; thin film transistors; 0.33 pA; 20 fA; Si; TFT; UV damage; channel region; high density SRAM; hydrogenation; leakage current; metal line; subthreshold characteristic; subthreshold swing; unshielded TFT; Grain boundaries; Leakage current; Liquid crystal displays; Plasma applications; Plasma measurements; Random access memory; Silicon; Thin film transistors; Threshold voltage; Tin;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.553058
  • Filename
    553058