DocumentCode
1278980
Title
Solder side up ¿ the move to surface mounting
Author
Dettmer, Roger
Volume
30
Issue
2
fYear
1984
fDate
2/1/1984 12:00:00 AM
Firstpage
117
Lastpage
120
Abstract
Technical and commercial pressures are forcing changes in the shape of electronic components and the way they are mounted. The most obvious manifestation of this trend is a move to surface mounting, so eliminating the need for leads on components and plated through holes on PCBs. This apparently simple change has serious implications for the electronics industry.
fLanguage
English
Journal_Title
Electronics and Power
Publisher
iet
ISSN
0013-5127
Type
jour
DOI
10.1049/ep.1984.0066
Filename
5187250
Link To Document