• DocumentCode
    1278980
  • Title

    Solder side up ¿ the move to surface mounting

  • Author

    Dettmer, Roger

  • Volume
    30
  • Issue
    2
  • fYear
    1984
  • fDate
    2/1/1984 12:00:00 AM
  • Firstpage
    117
  • Lastpage
    120
  • Abstract
    Technical and commercial pressures are forcing changes in the shape of electronic components and the way they are mounted. The most obvious manifestation of this trend is a move to surface mounting, so eliminating the need for leads on components and plated through holes on PCBs. This apparently simple change has serious implications for the electronics industry.
  • fLanguage
    English
  • Journal_Title
    Electronics and Power
  • Publisher
    iet
  • ISSN
    0013-5127
  • Type

    jour

  • DOI
    10.1049/ep.1984.0066
  • Filename
    5187250