Title :
ESD performance analysis of automotive application based on improved Integrated Circuit ESD model
Author :
Lafon, Frederic ; Fernandez-Lopez, Priscila ; Ramanujan, Abhishek
Author_Institution :
VALEO VEEM, Creteil, France
Abstract :
Electrostatic Discharge (ESD) is a major constraint for electronic product design and especially in automotive domain, where requirements can reach levels up to 25 kV. The reference standard cited in most of carmakers specification is the ISO 10605. Historically product design was mainly based on experience and experiments, but recent works started to develop modeling and simulation capabilities to justify the design. These approaches consist in black box modeling techniques based on characteristics extracted on the device to be modeled. Without demonstrated link with the physics, these modeling techniques are nevertheless the only acceptable and efficient method for concrete industrial deployment. The practical implementation of these Integrated Circuit (IC) models induced some issues, especially under Pspice being the targeted tool for our simulation. Divergences issues frequently occur during time domain simulation and were irresolvable with model proposed in (Rigour et al., 2009). We propose in this article a new implementation of the model in Pspice, as well as an updated general approach for black box model definition and generation. A practical example is used to demonstrate the capability of our model.
Keywords :
automotive electronics; circuit simulation; electrostatic discharge; integrated circuit modelling; product design; time-domain analysis; ESD performance analysis; ISO 10605; Pspice; automotive application; automotive domain; black box modeling techniques; carmakers specification; electronic product design; electrostatic discharge; industrial deployment; integrated circuit ESD model; time domain simulation; Capacitors; Electromagnetic compatibility; Electrostatic discharges; Integrated circuit modeling; SPICE; Switches; Automotive; ESD; Integrated Circuit; Modeling; Simulation; design;
Conference_Titel :
Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on
Conference_Location :
Gothenburg
DOI :
10.1109/EMCEurope.2014.6930957