Submicron p-channel (Al,Ga)As/(In,Ga)As HIGFETs

Submicron p-channel (Al,Ga)As/(In,Ga)As HIGFETs have been optimized for application to high-performance complementary GaAs circuits. Major issues with submicron and deep submicron (L_g⩽0.5-μm) P-channel HIGFETs have been the severe short-channel effects, such as high subthreshold leakage currents and high output conductances. With optimization of the p-type self-aligned implant schedule, control of impurity contamination at the substrate/buffer interfaces and increase of the resistivity of the unintentionally-doped GaAs buffers, high-performance submicron devices have been realized. Typically, 0.5-μm P-HIGFETs yielded room temperature transconductances of 90 mS/mm, drain currents at V_gs =V_ds=-1.5 V of 63 mA/mm, and subthreshold leakage currents near 1 nA. Subthreshold slope of 90 mV/decade and output conductances under 5 mS/mm were realized