• DocumentCode
    1279166
  • Title

    Thin oxide thickness extrapolation from capacitance-voltage measurements

  • Author

    Walstra, Steven V. ; Sah, Chih-Tang

  • Author_Institution
    Solid-State Electron. Lab., Florida Univ., Gainesville, FL, USA
  • Volume
    44
  • Issue
    7
  • fYear
    1997
  • fDate
    7/1/1997 12:00:00 AM
  • Firstpage
    1136
  • Lastpage
    1142
  • Abstract
    Five oxide-thickness extrapolation algorithms, all based on the same model (metal gate, negligible interface traps, no quantum effects), are compared to determine their accuracy. Three sets of parameters are used: (acceptor impurity concentration, oxide thickness, and temperature): (1016 cm-3, 250 Å, 300 K), (5×1017 Cm-3, 250 Å, 300 K), and (5×1017 cm-3, 50 Å, 150 K). Demonstration examples show that a new extrapolation method, which includes Fermi-Dirac statistics, gives the most accurate results, while the widely-used Co≃Cg (measured at the power supply voltage) is the least accurate. The effect of polycrystalline silicon gate is also illustrated
  • Keywords
    MOS capacitors; capacitance; extrapolation; impurity distribution; thickness measurement; 150 K; 250 angstrom; 300 K; 50 angstrom; C-V characteristics; Fermi-Dirac statistics; Si-SiO2; acceptor impurity concentration; capacitance-voltage measurements; gate depletion effect; impurity deionization; metal-gate MOS capacitor; model; oxide-thickness extrapolation algorithms; polycrystalline silicon gate; temperature; Capacitance-voltage characteristics; Extrapolation; Impurities; Power measurement; Power supplies; Silicon; Statistics; Temperature distribution; Thickness measurement; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.595942
  • Filename
    595942