DocumentCode :
1279405
Title :
An early detection method of device burn-in failure caused by tungsten side-diffusion through seam in premetal dielectric film
Author :
Lee, Sang-Yun ; Choi, Jeong ; Chen, Sean ; Liu, Wen-Shu ; McAllister, Ken
Author_Institution :
Res. & Dev. Center, Integrated Device Technol. Inc., Hillsboro, OR, USA
Volume :
23
Issue :
5
fYear :
2002
fDate :
5/1/2002 12:00:00 AM
Firstpage :
252
Lastpage :
254
Abstract :
A simple early detection method of defective devices before burn-in test has been discussed when the defect comes from tungsten side-diffusion through seams in premetal dielectric film. Tunneling current through thin remaining premetal dielectric film along seams caused by the tungsten side-diffusion has been measured and analyzed. Using the proposed early detection method, it becomes easy to compare seam formation in different premetal dielectric films and process parameters which affect seam formation.
Keywords :
dielectric thin films; diffusion; failure analysis; semiconductor device reliability; semiconductor device testing; tunnelling; detection method; device burn-in failure; premetal dielectric film; process parameters; seam; side-diffusion; tunneling current; Current measurement; Dielectric films; Failure analysis; Inspection; Leakage current; Scanning electron microscopy; Semiconductor films; Testing; Tungsten; Tunneling;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.998867
Filename :
998867
Link To Document :
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