Title :
Radiated emission from signal traces changing reference planes
Author :
van Doorn, Marcel
Author_Institution :
Philips Innovation Services - EMC Center, Eindhoven, Netherlands
Abstract :
This paper describes the radiated emission from signal traces changing reference planes in printed circuit boards. The effects of via distance, number of vias, plane distance, and stitching vias at the board edges have been investigated using 3D electromagnetic simulations. New quantitative EMC design guidelines for printed circuit boards to reduce radiated emission in the frequency range 100 MHz to 6 GHz are presented.
Keywords :
electromagnetic compatibility; electromagnetic waves; printed circuit design; vias; 3D electromagnetic simulations; board edges; frequency 100 MHz to 6 GHz; plane distance; printed circuit boards; quantitative EMC design guidelines; radiated emission; signal traces changing reference planes; stitching vias; via distance; Design methodology; Electromagnetic compatibility; Electromagnetics; Europe; Integrated circuit modeling; Printed circuits; Three-dimensional displays; 3D electromagnetic modeling; EMC design guidelines; printed circuit board design; radiated emission; reference planes; via crossing;
Conference_Titel :
Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on
Conference_Location :
Gothenburg
DOI :
10.1109/EMCEurope.2014.6930996
