Development of Electronic Board Conducted Emissions Model EBEM-CE using the bottom-up approach

Electronic equipments can include several electronic boards (passive and active circuits) in a confined space. However, conducted disturbances can propagate from one electronic board to another throw the interconnections and / or common ground. This can lead to the whole system dysfunction. This paper presents a modeling approach based on the bottom-up technique to predict the conducted emissions at system level by associating all subsystems models. This approach is applied, in this work, to develop Electronic Board Emission Model - Conducted Emissions (EBEM-CE) of the VT5.2 multilayer card demonstrator. It consists in the first step in modeling the different components of the electronic boards (Integrated Circuit (IC), Printed Circuit Board (PCB), decoupling capacitors ...). In a second, the EBEM-CE model can then be built up with the combination of all the components sub-models. In order to validate the proposed method, the modeling results are compared with measurements.