Title :
High Speed Digital Lines routed on non-metallic Spacecraft structures
Author :
Nicoletto, M. ; Boschetti, D. ; Savi, P.
Author_Institution :
Thales Alenia Space - Domain Exploration & Sci. Italy Eng. & Adv. Studies: Electr. Syst. & EMC, Turin, Italy
Abstract :
Space missions and satellites are critical in terms of data distribution. On-board spacecraft it is necessary to have a data-handling network that connects instruments, mass-memory, processors, downlink telemetry, and other on-board sub-systems. Alluminium is used when a low-inductance and low-resistance ground path for fault currents and for currents induced by electromagnetic interference (EMI) is required. Standards such as SpaceWire (SpW) offer high-speed, low-power, simplicity, relatively low implementation costs, and architectural flexibility. These characteristics make SpW ideal for many space missions. In this paper, the electromagnetic interference which occurs when standard aluminium panels are replaced by lighter materials, like Carbon-Fiber-Reinforced polymer (CFRP), is analyzed. The parameters used for this assessment are the radiated E-field from high speed digital lines such as the SpW and the Low-Voltage Differential Signal (LVDS).
Keywords :
artificial satellites; carbon fibre reinforced plastics; electromagnetic interference; fault currents; telemetry; CFRP; E-field radiation; EMI; LVDS; SpW standard; SpaceWire standard; alluminium low-inductance ground path; alluminium low-resistance ground path; carbon-fiber-reinforced polymer; data distribution; data-handling network; downlink telemetry; electromagnetic interference; fault current; high speed digital line; low-voltage differential signal; mass-memory; nonmetallic on-board spacecraft structure; satellite; space mission; Carbon; Conductivity; Electromagnetic compatibility; Europe; Grounding; Optical fiber polarization; Rails; CFRP; LVDS; carbon fiber; digital high speed line; grounding; spacecraft; spacewire;
Conference_Titel :
Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on
Conference_Location :
Gothenburg
DOI :
10.1109/EMCEurope.2014.6931011